Full automated slicer

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YAC DAStech, Inc

This is a full automatic slicer to cut thick or complex device which have realized to cut device by one pass in stead of step cut even device that old fashioned slicer used to cut by step cut. For: Complex devices such as devices containing sapphire, glass, ceramic and packaged devices such as CSP, QFP, QFN and metallic devices.

Slicing and dicing machine

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YAC DAStech, Inc

Automatic θ-AXIS, having automatic alignment function. Possible to cut thick device highly precisely by multi blade.

　Full automated core drilling machine (DAR810)

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YAC DAStech, Inc

This is full automatic drilling machine which cut the subject such as glass or quarts into circle shape or donuts shape by using core drill. This machine has auto transport and automatic alignment functions . Recently we introduced new equipment DAR806 which is applicable to smaller diameter ( 1to 10) with ultra sonic spindle

　Full automated core drilling machine (DAR806)

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YAC DAStech, Inc

We purchase, repair and resell secondhand dicing equipment, cutting equipment and semiconductor manufacturing equipment.